BOM KITTING

Huashu Technology maintains a long-term component inventory of 20 million pcs with warehouses in Shenzhen and Hong Kong. to serve as an effective response to possible out-of-stock situations.

In 2022, there were material inventory overstocks in various parts of the industry chain, including manufacturers, agents distribution and end customers. Despite the impact of the previous year’s shortage wave, but thanks to Huashu Technology’s perennial deep plowing of end customers and the upstream and downstream of the industry chain, adhere to reasonable prices, through the long-term production plan scheduling of both supply and demand, the formation of device supply community to cope with the lack of core environment, recognized by customers; in the face of the previous year’s shortages, price increases, we are very sensible and restrained, more strengthen the interaction with the upstream and downstream, in the electronic components industry to learn Forecasting, planning for a rainy day is extremely important. According to the law of the industry, after a big rise there will be a big fall, the other end of the supply will inevitably be oversupply, so Huashu in the lack of up period, efforts to help customers to solve the supply, but also care about the end product situation, rational scheduling, although part of the plan still can not catch up with the precipitous decline in demand, but the overall inventory situation of our company is not a big impact. In the face of the cold winter in the chip industry this year, Huashu will make adjustments in three areas:

A. In 2022, we will focus on cost reduction for customers, and take the role of IoT solution provider to serve customers in a diversified way.

B, on the other hand, according to the market environment, upstream channel information, adjust the company’s product line management strategy, to provide customers with timely advice and market warning;

C. Strengthen the ability to integrate resources and provide customers with a complete set of supply chain services from chip cost to solutions, hoping to achieve closer and deeper cooperation between this and our regular customers to better serve our customers, who will consider us valuable and can become their trusted partners.

Last year’s global semiconductor industry shortage and price increase wave, for electronic components distributors, is indeed a year of opportunities and challenges. Some originally scheduled orders, due to various upstream factors, resulted in affecting the normal delivery of customers’ orders. Huashu in the company’s main product line, as well as to the terminal with the order of products, will choose the appropriate for the customer’s order, prepared in advance of the stock; especially for the terminal customer with the order of general material, our company sent technical staff for customers to select, alternative to the company’s price, delivery of controllable brand; therefore, our company to ensure relatively smooth delivery, the addition of Hong Kong / Shenzhen warehouse, pay attention to the Shenzhen and Hong Kong warehousing equipped, and support both inside and outside Fast delivery, whether from upstream supply, or logistics, with systematic and efficient distribution services to customers.

BOM contains the following elements:

1. Marking: the ability to quickly locate these components on the schematic diagram, and the ability to install the device in the correct position when the PCB is welded and installed;
2. Quantity: the number of devices of the same one type on a board;
3. Model: each device model is different, the same model may correspond to different manufacturers, in the BOM also need to mark the information of the manufacturer;
4. Value: the value of the device, such as resistors, capacitors, etc.;
5. Manufacturer: provide the original manufacturer of the device;
6. Description: relatively complete information given on the characteristics of the device, according to which the requirements of the device can be correctly analyzed;
7. Encapsulation: the corresponding mounting information of the device on the board.